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UID:6a7be1bbd2f6b@www.leap-up.com
DTSTAMP:20260812T050011Z
DTSTART:20230628T160000
DTEND:20230628T170000
SUMMARY:Chiplet based Sensor fusion platform for autonomous driving and AGVs
DESCRIPTION:Based on the state of the art of integration technologies\, our webinar shows possible integration approaches for chiplet based multi die systems to build future sensor fusion platforms&nbsp\;e.g. for ADAS and AGV application. Furthermore\, we discuss current and future chip to chip standards and their advantages and disadvantages for automotive and AGV&nbsp\;applications.\nMore
LOCATION:Fraunhofer IIS/EAS\, Dresden
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