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UID:6ae52d5996fac@www.leap-up.com
DTSTAMP:20261031T005049Z
DTSTART:20261124T153000
DTEND:20261125T153000
SUMMARY:Chiplets as an Enabler for Architecture Innovation to Master Automotive Ecosystem Transformation Workshop
DESCRIPTION:Co-organized with Fraunhofer IIS the workshop is an in-person event for automobile manufacturers\, suppliers\, semiconductor vendors\, tool providers\, research institutes\, and other interested parties to exchange knowledge and experience in automotive electronics.\nThe program covers the state of the art in chiplets\, the OEM and tier-1 perspectives on the shift from mechatronics to hardware architectures supporting software flexibility\, international approaches to new automotive architectures\, and system engineering for seamless integration.\nChiplets let system functions be split across multiple dies from different suppliers\, combined in a single package. The approach allows different manufacturing nodes to be mixed\, pre-validated blocks to be reused\, and one architecture to scale across performance classes. For automotive use\, it also raises questions that cut across supplier boundaries: how components are qualified\, tested\, and diagnosed across a vehicle lifetime\, and what that means for tool chains\, exchange formats\, and system integration.\nThe Program Committee welcomes presentation proposals and discussion topics to be sent by email to av4maas-chair@ieee.org .  Your viewpoints are highly appreciated.
LOCATION:Fraunhofer IIS\, Münchner Str. 16\, 01187 Dresden
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