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UID:69dce3639341a@www.leap-up.com
DTSTAMP:20260413T143651Z
DTSTART:20211027T130000Z
DTEND:20211027T140000Z
SUMMARY:IC Reliability – an Overview
DESCRIPTION:Our webinar on IC reliability provides an overview on measurements and simulations to ensure the reliability of ICs\, especially for long-term applications. In particular\, we highlight the flow from technology qualification based on wafer level reliability measurements to degradation models that can be used in aging simulations to virtually investigate the reliability of a design before entering manufacturing.
LOCATION:Fraunhofer IIS/EAS\, Dresden
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