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UID:6a01eec0a15cd@www.leap-up.com
DTSTAMP:20260511T165912Z
DTSTART:20220608T150000
DTEND:20220608T160000
SUMMARY:IC Reliability – an Overview
DESCRIPTION:Our webinar on IC reliability provides an overview on measurements and simulations to ensure the reliability of ICs\, especially for long-term applications. In particular\, we highlight the flow from technology qualification based on wafer level reliability measurements to degradation models that can be used in aging simulations to virtually investigate the reliability of a design before entering manufacturing.
LOCATION:Fraunhofer IIS/EAS\, Münchner Straße\, 01187 Dresden
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