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UID:6a0761c9e75da@www.leap-up.com
DTSTAMP:20260515T201121Z
DTSTART:20221207T160000
DTEND:20221207T170000
SUMMARY:More than Moore via 2.5D IC Integration - Automotive Electronic Control Unit (ECU) for ADAS Application Based on a Chiplet Approach
DESCRIPTION:Based on the state of the art of integration technologies\, our webinar shows possible integration approaches for chiplet-based multi-die systems to build future ECU architecture e.g. for ADAS application. Furthermore\, we discuss current and future chip to chip standards and their advantages and disadvantages for automotive applications.\nThe live webinar is an interactive event and offers the opportunity to enter into an exchange of experience and knowledge with current topics.
LOCATION:Online\, Dresden
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