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UID:69dcb1a94ecbb@www.leap-up.com
DTSTAMP:20260413T110441Z
DTSTART:20260602T120000Z
DTEND:20260603T160000Z
SUMMARY:Workshop „Photonic Integrated Circuits | Mapping Thin-Film Processes to Industrial Architectures“
DESCRIPTION:Photonic Integrated Circuits (PICs) are a key enabling technology for modern photonic systems and are used in a wide range of applications\, including optical communication\, data centers\, sensing\, medical technology\, quantum technologies\, and autonomous driving/systems. A central factor for their performance and scalability is the precise design\, fabrication\, and integration of thin‑film processes into industrial PIC architectures.\nThe workshop provides an overview of current developments and challenges along the entire process chain – from thin‑film materials and deposition technologies to their scale‑up and industrialization on photonic platforms relevant for manufacturing environments. Key topics include process integration\, scalability\, robustness\, and manufacturability of photonic integrated circuits\, as well as cross‑cutting aspects related to their implementation in industrial contexts. Both technological fundamentals and selected practical perspectives on industrial realization will be addressed\, with the aim of fostering exchange between research and industry and stimulating new solution approaches.\nThe event is aimed at experts from research\, development\, and industry who are working with photonic integrated circuits\, thin‑film technologies\, and photonic system integration\, as well as those planning to engage in this field in the future.
LOCATION:Fraunhofer Heinrich‑Hertz‑Institut HHI\, Einsteinufer 37\, 10587 Berlin
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