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Chiplet based Sensor fusion platform for autonomous driving and AGVs

Name: Chiplet based Sensor fusion platform for autonomous driving and AGVs
Start: 2023-06-28T16:00:00+02:00
End: 2023-06-28T17:00:00+02:00
Location: Fraunhofer IIS/EAS

Online seminar
Evening event
Event
Networking event
Training

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Date & Time

from: 28/06/202316:00 pm
until: 28/06/202317:00 pm
duration: 1hour

Location

place: Fraunhofer IIS/EAS
city: Dresden Germany

Contact

Last name: Ms. - Marie Noack
Fraunhofer IIS/EAS
email: Znevr.Abnpx@rnf.vvf.senhaubsre.qr

Based on the state of the art of integration technologies, our webinar shows possible integration approaches for chiplet based multi die systems to build future sensor fusion platforms e.g. for ADAS and AGV application. Furthermore, we discuss current and future chip to chip standards and their advantages and disadvantages for automotive and AGV applications.

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