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More than Moore via 2.5D IC integration technology - Automotive electronic control unit (ECU) for ADAS application based on a Chiplet approach

Date & Time

from
12/10/202216:00 pm
until
12/10/202217:00 pm
duration
1hour

Location

city
Dresden Deutschland

Contact

Last name
Mr. - Marie Noack
Fraunhofer EAS
email

Based on the state of the art of integration technologies, our webinar shows possible integration approaches for chiplet based multi die systems to build future ECU architecture e.g. for ADAS application. Furthermore, we discuss current and future chip to chip standards and their advantages and disadvantages for automotive applications.


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